Technological Capabilities

Technological Capabilities
		PCB Standard Online up to 3,0m²	Mass Production > 3,0m²	Full feature
Layers		1 - 2 layers	1 - 8 layers	1 - 12 layers
Materials		FR-4 (TG135)	FR-4 (TG135) FR-4 (TG150; TG170) AL CORE (1.0÷4.0w/mk)	FR-4 (TG135) FR-4 (TG150; TG170) AL CORE (1.0÷4.0w/mk)
Material thickness		0,5 mm 0,8 mm 1,0 mm 1,2 mm 1,5 mm 2,0 mm	0,5 mm 0,8 mm 1,0 mm 1,2 mm 1,5 mm 2,0 mm	0,5 mm 0,8 mm 1,0 mm 1,2 mm 1,5 mm 2,0 mm
copper thickness (base)*	single layer double layer & multilayer*	35; 70um 18; 35; 70um	35; 70; 105um 18; 35; 70; 105um	35; 70; 105um 18; 35; 70; 105um
Min tracks @ base copper	18 um 35 um 70; 105 um**	0,127 mm (5 mils) 0,152 mm (6 mils) 0,200 mm (8 mils)	0,102 mm (4 mils) 0,127 mm (5 mils) 0,152 mm (6 mils)	0,102 mm (4 mils) 0,102 mm (4 mils) 0,127 mm (5 mils)
Min spaces @ base copper	18 um 35 um 70; 105 um**	0,127 mm (5 mils) 0,152 mm (6 mils) 0,200 mm (8 mils)	0,102 mm (4 mils) 0,127 mm (5 mils) 0,152 mm (6 mils)	0,102 mm (4 mils) 0,102 mm (4 mils) 0,127 mm (5 mils)
annular ring @ base copper	18; 35 um 70; 105 um	0,127 mm (5 mils) 0,200 mm (8 mils)	0,102 mm (4 mils) 0,152 mm (6 mils)	0,102 mm (4 mils) 0,152 mm (6 mils)
min drill / pad @ FR4 thickness	FR4 0,5÷1,0 mm FR4 1,2÷2,0 mm	0,3 mm / 0,6mm 0,4 mm / 0,7mm	0,2 mm / 0,45 mm 0,25 mm / 0,5 mm	0,15 mm / 0,35 mm 0,2 mm / 0,4 mm
min distance: copper to edge	Routing V-CUT: @FR4 0,5÷1,0 mm V-CUT: @FR4 1,2÷1,5mm V-CUT: @FR4 2,0 mm	0,254 mm / 10 mils 0,305 mm / 12 mils 0,508 mm / 20 mils 0,635 mm / 25 mils	0,254 mm / 10 mils 0,305 mm / 12 mils 0,508 mm / 20 mils 0,635 mm / 25 mils	0,254 mm / 10 mils 0,305 mm / 12 mils 0,508 mm / 20 mils 0,635 mm / 25 mils
Solder masks		Green, Blue, Red, White, Black	Green, Blue, Red, White, Solid white Black, Solid black	Green, Blue, Red, White, Solid white Black, Solid black
Service print		White, Black	White, Black	White, Black
Mechanical job		Routing, V-CUT	Routing, V-CUT	Routing, V-CUT
Finish surface		LF HASL ENIG	LF HASL ENIG Silver	LF HASL ENIG Silver
Аdditional coverages		Capton Tape, PEELABLE MASK	Capton Tape, PEELABLE MASK	Capton Tape, PEELABLE MASK
Quality control		DRC Analysis, flying probe E-test	DRC + DFF Analysis, Visual Control, E-test	DRC + DFF Analysis, Visual Control, E-test

* base copper = Copper thickness before plating. During plating process, copper increase with 20 microns.

** 18um=0,5 Oz; 35um=1,0 Oz; 70um=2,0 Oz; 105um=3,0 Oz

Technological Capabilities PCB Standard Online up to 3,0m² Mass Production > 3,0m² Full feature Layers 1 - 2... read more »

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Technological Capabilities
		PCB Standard Online up to 3,0m²	Mass Production > 3,0m²	Full feature
Layers		1 - 2 layers	1 - 8 layers	1 - 12 layers
Materials		FR-4 (TG135)	FR-4 (TG135) FR-4 (TG150; TG170) AL CORE (1.0÷4.0w/mk)	FR-4 (TG135) FR-4 (TG150; TG170) AL CORE (1.0÷4.0w/mk)
Material thickness		0,5 mm 0,8 mm 1,0 mm 1,2 mm 1,5 mm 2,0 mm	0,5 mm 0,8 mm 1,0 mm 1,2 mm 1,5 mm 2,0 mm	0,5 mm 0,8 mm 1,0 mm 1,2 mm 1,5 mm 2,0 mm
copper thickness (base)*	single layer double layer & multilayer*	35; 70um 18; 35; 70um	35; 70; 105um 18; 35; 70; 105um	35; 70; 105um 18; 35; 70; 105um
Min tracks @ base copper	18 um 35 um 70; 105 um**	0,127 mm (5 mils) 0,152 mm (6 mils) 0,200 mm (8 mils)	0,102 mm (4 mils) 0,127 mm (5 mils) 0,152 mm (6 mils)	0,102 mm (4 mils) 0,102 mm (4 mils) 0,127 mm (5 mils)
Min spaces @ base copper	18 um 35 um 70; 105 um**	0,127 mm (5 mils) 0,152 mm (6 mils) 0,200 mm (8 mils)	0,102 mm (4 mils) 0,127 mm (5 mils) 0,152 mm (6 mils)	0,102 mm (4 mils) 0,102 mm (4 mils) 0,127 mm (5 mils)
annular ring @ base copper	18; 35 um 70; 105 um	0,127 mm (5 mils) 0,200 mm (8 mils)	0,102 mm (4 mils) 0,152 mm (6 mils)	0,102 mm (4 mils) 0,152 mm (6 mils)
min drill / pad @ FR4 thickness	FR4 0,5÷1,0 mm FR4 1,2÷2,0 mm	0,3 mm / 0,6mm 0,4 mm / 0,7mm	0,2 mm / 0,45 mm 0,25 mm / 0,5 mm	0,15 mm / 0,35 mm 0,2 mm / 0,4 mm
min distance: copper to edge	Routing V-CUT: @FR4 0,5÷1,0 mm V-CUT: @FR4 1,2÷1,5mm V-CUT: @FR4 2,0 mm	0,254 mm / 10 mils 0,305 mm / 12 mils 0,508 mm / 20 mils 0,635 mm / 25 mils	0,254 mm / 10 mils 0,305 mm / 12 mils 0,508 mm / 20 mils 0,635 mm / 25 mils	0,254 mm / 10 mils 0,305 mm / 12 mils 0,508 mm / 20 mils 0,635 mm / 25 mils
Solder masks		Green, Blue, Red, White, Black	Green, Blue, Red, White, Solid white Black, Solid black	Green, Blue, Red, White, Solid white Black, Solid black
Service print		White, Black	White, Black	White, Black
Mechanical job		Routing, V-CUT	Routing, V-CUT	Routing, V-CUT
Finish surface		LF HASL ENIG	LF HASL ENIG Silver	LF HASL ENIG Silver
Аdditional coverages		Capton Tape, PEELABLE MASK	Capton Tape, PEELABLE MASK	Capton Tape, PEELABLE MASK
Quality control		DRC Analysis, flying probe E-test	DRC + DFF Analysis, Visual Control, E-test	DRC + DFF Analysis, Visual Control, E-test

* base copper = Copper thickness before plating. During plating process, copper increase with 20 microns.

** 18um=0,5 Oz; 35um=1,0 Oz; 70um=2,0 Oz; 105um=3,0 Oz

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