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Technological Capabilities
    PCB Standard Online
up to 3,0m²		 Mass Production
>  3,0m²		 Full feature
Layers   1 - 2 layers 1 - 8 layers 1 - 12 layers
Materials   FR-4 (TG135) FR-4 (TG135)
FR-4 (TG150; TG170)
AL CORE (1.0÷4.0w/mk)		 FR-4 (TG135)
FR-4 (TG150; TG170)
AL CORE (1.0÷4.0w/mk)
Material
thickness		   0,5 mm
0,8 mm
1,0 mm
1,2 mm
1,5 mm
2,0 mm		 0,5 mm
0,8 mm
1,0 mm
1,2 mm
1,5 mm
2,0 mm		 0,5 mm
0,8 mm
1,0 mm
1,2 mm
1,5 mm
2,0 mm
copper thickness
   (base)*		  single layer
 double layer & multilayer*		 35; 70um
18; 35; 70um		 35; 70; 105um
18; 35; 70; 105um		 35; 70; 105um
18; 35; 70; 105um
Min tracks
  @ base copper		  18 um**
 35 um**
 70; 105 um**		 0,127 mm (5 mils)
0,152 mm (6 mils)
0,200 mm (8 mils)		 0,102 mm (4 mils)
0,127 mm (5 mils)
0,152 mm (6 mils)		 0,102 mm (4 mils)
0,102 mm (4 mils)
0,127 mm (5 mils)
Min spaces
  @ base copper		  18 um**
 35 um**
 70; 105 um**		 0,127 mm (5 mils)
0,152 mm (6 mils)
0,200 mm (8 mils)		 0,102 mm (4 mils)
0,127 mm (5 mils)
0,152 mm (6 mils)		 0,102 mm (4 mils)
0,102 mm (4 mils)
0,127 mm (5 mils)
annular ring
  @ base copper		  18; 35 um**
 70; 105 um**		 0,127 mm (5 mils)
0,200 mm (8 mils)		 0,102 mm (4 mils)
0,152 mm (6 mils)		 0,102 mm (4 mils)
0,152 mm (6 mils)
min drill / pad
  @ FR4 thickness		  FR4     0,5÷1,0 mm
 FR4     1,2÷2,0 mm		 0,3 mm / 0,6mm
0,4 mm / 0,7mm		 0,2 mm / 0,45 mm
0,25 mm / 0,5 mm		 0,15 mm / 0,35 mm
0,2 mm / 0,4 mm
min distance:
copper to edge		  Routing
 V-CUT:  @FR4  0,5÷1,0 mm
 V-CUT:  @FR4  1,2÷1,5mm
 V-CUT:  @FR4  2,0 mm		 0,254 mm / 10 mils
0,305 mm / 12 mils
0,508 mm / 20 mils
0,635 mm / 25 mils		 0,254 mm / 10 mils
0,305 mm / 12 mils
0,508 mm / 20 mils
0,635 mm / 25 mils		 0,254 mm / 10 mils
0,305 mm / 12 mils
0,508 mm / 20 mils
0,635 mm / 25 mils
Solder masks   Green,
Blue,
Red,
White,
Black		 Green,
Blue,
Red,
White, Solid white
Black, Solid black		 Green,
Blue,
Red,
White, Solid white
Black, Solid black
Service print   White, Black White, Black White, Black
Mechanical job   Routing,
V-CUT		 Routing,
V-CUT		 Routing,
V-CUT
Finish surface   LF HASL
ENIG		 LF HASL
ENIG
Silver		 LF HASL
ENIG
Silver
Аdditional
coverages		   Capton Tape,
PEELABLE MASK		 Capton Tape,
PEELABLE MASK		 Capton Tape,
PEELABLE MASK
Quality control   DRC Analysis,
flying probe E-test		 DRC + DFF Analysis,
Visual Control,
E-test		 DRC + DFF Analysis,
Visual Control,
E-test

 

 * base copper = Copper thickness before plating. During plating process, copper increase with 20 microns.

**  18um=0,5 Oz;   35um=1,0 Oz;   70um=2,0 Oz;   105um=3,0 Oz

Technological Capabilities     PCB Standard Online up to 3,0m² Mass Production >  3,0m² Full feature Layers   1 - 2... read more »
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Technological Capabilities
    PCB Standard Online
up to 3,0m²		 Mass Production
>  3,0m²		 Full feature
Layers   1 - 2 layers 1 - 8 layers 1 - 12 layers
Materials   FR-4 (TG135) FR-4 (TG135)
FR-4 (TG150; TG170)
AL CORE (1.0÷4.0w/mk)		 FR-4 (TG135)
FR-4 (TG150; TG170)
AL CORE (1.0÷4.0w/mk)
Material
thickness		   0,5 mm
0,8 mm
1,0 mm
1,2 mm
1,5 mm
2,0 mm		 0,5 mm
0,8 mm
1,0 mm
1,2 mm
1,5 mm
2,0 mm		 0,5 mm
0,8 mm
1,0 mm
1,2 mm
1,5 mm
2,0 mm
copper thickness
   (base)*		  single layer
 double layer & multilayer*		 35; 70um
18; 35; 70um		 35; 70; 105um
18; 35; 70; 105um		 35; 70; 105um
18; 35; 70; 105um
Min tracks
  @ base copper		  18 um**
 35 um**
 70; 105 um**		 0,127 mm (5 mils)
0,152 mm (6 mils)
0,200 mm (8 mils)		 0,102 mm (4 mils)
0,127 mm (5 mils)
0,152 mm (6 mils)		 0,102 mm (4 mils)
0,102 mm (4 mils)
0,127 mm (5 mils)
Min spaces
  @ base copper		  18 um**
 35 um**
 70; 105 um**		 0,127 mm (5 mils)
0,152 mm (6 mils)
0,200 mm (8 mils)		 0,102 mm (4 mils)
0,127 mm (5 mils)
0,152 mm (6 mils)		 0,102 mm (4 mils)
0,102 mm (4 mils)
0,127 mm (5 mils)
annular ring
  @ base copper		  18; 35 um**
 70; 105 um**		 0,127 mm (5 mils)
0,200 mm (8 mils)		 0,102 mm (4 mils)
0,152 mm (6 mils)		 0,102 mm (4 mils)
0,152 mm (6 mils)
min drill / pad
  @ FR4 thickness		  FR4     0,5÷1,0 mm
 FR4     1,2÷2,0 mm		 0,3 mm / 0,6mm
0,4 mm / 0,7mm		 0,2 mm / 0,45 mm
0,25 mm / 0,5 mm		 0,15 mm / 0,35 mm
0,2 mm / 0,4 mm
min distance:
copper to edge		  Routing
 V-CUT:  @FR4  0,5÷1,0 mm
 V-CUT:  @FR4  1,2÷1,5mm
 V-CUT:  @FR4  2,0 mm		 0,254 mm / 10 mils
0,305 mm / 12 mils
0,508 mm / 20 mils
0,635 mm / 25 mils		 0,254 mm / 10 mils
0,305 mm / 12 mils
0,508 mm / 20 mils
0,635 mm / 25 mils		 0,254 mm / 10 mils
0,305 mm / 12 mils
0,508 mm / 20 mils
0,635 mm / 25 mils
Solder masks   Green,
Blue,
Red,
White,
Black		 Green,
Blue,
Red,
White, Solid white
Black, Solid black		 Green,
Blue,
Red,
White, Solid white
Black, Solid black
Service print   White, Black White, Black White, Black
Mechanical job   Routing,
V-CUT		 Routing,
V-CUT		 Routing,
V-CUT
Finish surface   LF HASL
ENIG		 LF HASL
ENIG
Silver		 LF HASL
ENIG
Silver
Аdditional
coverages		   Capton Tape,
PEELABLE MASK		 Capton Tape,
PEELABLE MASK		 Capton Tape,
PEELABLE MASK
Quality control   DRC Analysis,
flying probe E-test		 DRC + DFF Analysis,
Visual Control,
E-test		 DRC + DFF Analysis,
Visual Control,
E-test

 

 * base copper = Copper thickness before plating. During plating process, copper increase with 20 microns.

**  18um=0,5 Oz;   35um=1,0 Oz;   70um=2,0 Oz;   105um=3,0 Oz

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